Advanced Packaging Development Engineer
Core
Design and optimize innovative packaging processes and equipment for next-generation semiconductor technologies to enhance reliability, manufacturability, and performance in high-volume manufacturing.
Role type
Senior IC packaging process development engineer
Builds
Semiconductor packaging solutions for high-performance, edge, and mobile computing applications
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Process development, equipment qualification, Statistical Process Control (SPC), Design of Experiments (DOE), cross-functional collaboration, supplier management, technical documentation, data analysis
Preferred skills
Technical team leadership, semiconductor fabrication process knowledge, process characterization, time-sensitive project delivery, Python/MATLAB/SQL proficiency
Technologies
Python, MATLAB, SQL, SPC tools, DOE tools
Responsibilities
Develop and qualify packaging assembly processes and materials; Drive experimental design using SPC and DOE; Innovate techniques to address packaging reliability challenges; Collaborate with cross-functional teams to mitigate technical risks; Establish process specifications and work with suppliers; Document technical findings and process improvements; Support equipment performance in development and manufacturing environments
Seniority
Senior, hands-on IC