CareerPlan

Module Development Engineer

US, Oregon, HillsboroFull-time$134k–$189k2026-11-06 → 2026-11-10
Hybrid

Core

Design, execute, and analyze experiments to optimize semiconductor manufacturing processes for yield, functionality, and efficiency.

Role type

Module Development Engineer (Semiconductor Process Engineering)

Builds

Advanced semiconductor manufacturing processes and device architectures

Domain

Semiconductor manufacturing / Materials Science

Required skills

Semiconductor manufacturing techniques (lithography, etching, thin film deposition, planarization), Process characterization (SPC, DOE), Statistical analysis (MATLAB, JMP, Python), Materials characterization (SEM, TEM, XPS, ellipsometry), Equipment optimization, Metrology system design

Preferred skills

Advanced device architectures (transistor scaling, selectivity control), Equipment troubleshooting and maintenance, Vacuum processes (ALD, CVD), Cross-functional collaboration

Technologies

MATLAB, JMP, Python, SEM, TEM, XPS, ellipsometry, ALD, CVD

Responsibilities

Design and execute experiments to optimize manufacturing processes, Develop and sustain semiconductor processing techniques, Conduct feasibility studies for next-generation device architectures, Collaborate with suppliers to integrate novel technology solutions, Perform process characterization using SPC and DOE, Support technology transfer to high-volume manufacturing

Seniority

Mid-level, hands-on IC