Quantum IC Package Substrate Design Engineer
On-site · United States
Core
Design large form factor IC substrates for silicon-based quantum processors using Siemens Xpedition, integrating 2.5D/3D packaging and collaborating with SI/PI/thermal teams.
Role type
IC Package Substrate Design Engineer
Builds
Silicon quantum dot processors and scalable quantum systems
Domain
Semiconductor manufacturing / Quantum Computing
Required skills
Siemens Xpedition, high-speed signal routing, large form factor IC substrate design, DRC/LVS, 2.5D/3D packaging integration
Preferred skills
AI/physics-based routing engines, SI/PI/thermal impact analysis
Technologies
Siemens Xpedition
Responsibilities
Design IC substrates, validate designs via DRC/LVS, coordinate tapeout with suppliers, collaborate on signal/power/thermal integrity, present design milestones
Seniority
Senior, hands-on IC
