PCB/RF Design Engineer
Core
Design critical microwave components, high-density cryo-compatible PCB layouts, and novel packaging solutions for large-scale 3D quantum processors operating from room temperature to millikelvin.
Role type
Senior RF/PCB Design Engineer (Quantum Hardware)
Builds
Next-generation 3D quantum hardware architecture (QPUs) and critical electromechanical interfaces
Domain
Quantum Computing / RF Engineering / Cryogenics
Required skills
PCB design, RF/Microwave Engineering, CAD (KiCAD, Altium, Cadence), Cryogenic hardware design, Schematic development, Signal integrity analysis, Impedance matching, Thermal cycling analysis, High-density interconnects
Preferred skills
Cofired ceramic boards (LTCC, HTCC), Superconducting technologies, RF testing (VNA), 3D packaging, Flex interconnects
Technologies
KiCAD, Altium Designer, Cadence, VNA, Dilution refrigerators
Responsibilities
Design critical electromechanical components for QPUs and TWPAs, Create high-density cryo-compatible PCB layouts, Solve complex RF challenges (insertion loss, cross-talk), Validate performance across full temperature range (room temp to millikelvin), Run cooldown/characterization tests in dilution refrigerators
Seniority
Mid-Senior, hands-on IC
