NMSI F11X Thin Films Module Engineer-Technologist
Core
Lead process innovation and manufacturing excellence for thin-film deposition processes (CVD, ALD, PVD) in advanced semiconductor packaging.
Role type
Senior Technical Leader, Thin Films Module Engineer-Technologist
Builds
Advanced packaging technologies including EMIB, Foveros, and Silicon Photonics solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin-film deposition process engineering, Statistical Process Control (SPC), Design of Experiments (DOE), manufacturing automation, equipment optimization, technical problem-solving, cross-functional leadership
Preferred skills
Through-Silicon Via (TSV) processing, advanced packaging technology expertise, semiconductor foundry experience, research publications/patents, cross-organizational boundary management
Technologies
CVD, ALD, PVD, PECVD, LPCVD, HDP, Epitaxy, EMIB, Foveros, Silicon Photonics
Responsibilities
Champion safety, quality, yield, throughput, and cost optimization; drive defect reduction and process capability improvements; lead technical problem-solving for aggressive technology node targets; optimize equipment performance with suppliers; develop robust process controls; align technical strategies with customer requirements and roadmaps; analyze complex technical data for actionable solutions; resolve critical manufacturing challenges; mentor technical talent
Seniority
Senior, hands-on IC with strategic leadership
