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TD Thin Films Process Development Engineer DRAM

Boise, ID - Main Site💼 Full-time🗓 2026-05-05 → 2026-07-31

Core

Developing thin-film deposition techniques and process solutions for High Aspect Ratio Advanced DRAM features.

Role type

Process Development Engineer (Semiconductor Manufacturing)

Builds

Next-generation DRAM devices

Domain

Semiconductor / Memory Technology / Materials Science

Deliverable

production ML models | product features | infrastructure

Required skills

Thin-film deposition, process troubleshooting, ALD, epitaxy, plasma-based deposition, DOE, SPC

Preferred skills

AI application, coding, data science, cross-functional collaboration

Technologies

ALD, epitaxy, plasma-based deposition tools

Responsibilities

Develop new thin-film deposition techniques, relate on-wafer performance to hardware performance, lead multi-functional initiatives, partner with suppliers and internal teams, implement development timelines, resolve feasibility issues

Seniority

Mid-level IC

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