Module Development Engineer
Core
Develop and sustain Chemical Mechanical Planarization (CMP) techniques for diverse materials and architectures to enable rapid miniaturization and mass production of integrated circuits.
Role type
Process Development Engineer (CMP)
Builds
Manufacturing processes and equipment solutions for high-volume manufacturing and future technology nodes
Domain
Semiconductor fabrication / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, process integration, material selection, parameter optimization, equipment metrology, theoretical simulations, practical engineering methods, vendor ecosystem partnership, roadmap development
Preferred skills
Statistics, Statistical Process Control (SPC), Design of Experiments (DOE), experimental lab work, advanced transistor device structures, fabrication (lithography, etch, film deposition, CMP), data analysis (MATLAB, Excel, JMP), materials and physical device characterization (SEM, TEM)
Technologies
SEM, TEM, MATLAB, Excel, JMP, CMP, lithography, etch, film deposition
Responsibilities
Drive technology development and enablement for high volume manufacturing and future technology; Lead design and development of sophisticated manufacturing processes and repair reverse engineering; Perform pathfinding activities and develop roadmaps for innovative device architectures; Recommend and implement equipment modifications to improve production efficiency; Partner with equipment and materials suppliers; Perform process technology feasibility studies via simulations and engineering methods
Seniority
Mid-level IC
