Senior CMP Process engineer
Core
Planarizing wafer surfaces using Chemical Mechanical Polishing (CMP) to ensure high-precision chip layering.
Role type
Senior IC CMP Process Engineer
Builds
Semiconductor wafers for advanced chip manufacturing
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Required skills
CMP fundamentals (dielectric/metal), Statistical Process Control (SPC), Fault Detection and Classification (FDC), root-cause analysis (FMEA/8D), DOE, JMP/Spotfire analysis
Preferred skills
Metrology tools (Ellipsometry/SEM/AFM), defect reduction, fab integration knowledge
Technologies
AMAT, Ebara, JMP, Spotfire
Responsibilities
Control Removal Rate (RR) and thickness skew, optimize process conditions for uniformity, manage recipes (RCP) for flatness, manage defects and uniformity, monitor consumable life cycles, evaluate slurry and pad performance
Seniority
Senior, hands-on IC