Staff Chemical Mechanical Planarization (CMP) Engineer
Core
Lead Chemical Mechanical Planarization (CMP) process development, optimization, and standardization for advanced logic technologies (18A, Intel 3, 12nm) to ensure high-volume manufacturing readiness.
Role type
Staff IC CMP Engineer (Process Development & Technical Leadership)
Builds
Advanced logic semiconductor processes for Intel Foundry customers
Domain
Semiconductor Manufacturing / Process Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP process development, cross-node standardization, yield problem resolution, equipment platform expertise (AMAT, Ebara), consumables management (slurries, pads, conditioning disks), metrology interpretation
Preferred skills
GAA architecture experience, CMP integration with deposition/lithography/etch/clean, advanced metrology (thickness, topography, defects, roughness, particles), cross-functional task force leadership
Technologies
AMAT, Ebara, CMP equipment platforms
Responsibilities
Lead CMP process development from concept through HVM implementation, drive cross-node alignment and best practices, resolve complex CMP-related yield and manufacturing issues, align technical strategies with customer requirements, bridge technology development and manufacturing teams, mentor junior engineers
Seniority
Staff, hands-on IC with strategic execution and mentorship