Senior Engineer I, Process Engineering [CMP]
Core
Develop, qualify, and optimize Chemical Mechanical Polishing (CMP) unit processes and post-CMP cleaning for advanced semiconductor logic, memory, analog, power, and MEMS applications.
Role type
Senior IC Process Engineer (CMP)
Builds
Robust CMP processes and cleaning chemistries for FEOL/BEOL applications
Domain
Semiconductor manufacturing / Chemical Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (Process Development & Integration)
Required skills
CMP process development, slurry chemistry formulation, defectivity reduction, metrology and surface characterization, Design of Experiments (DOE), Statistical Process Control (SPC), root cause analysis, process transfer and documentation
Preferred skills
Pattern-dependent CMP effects modeling, materials interactions in CMP, device integration requirements across FEOL/BEOL flows, remote customer site support
Technologies
CMP platforms, profilometry, ellipsometry, AFM, SEM, optical inspection, slurry delivery systems, pad conditioning modules
Responsibilities
Design and conduct complex experiments to optimize removal rate, uniformity, and defectivity; formulate and tune slurry chemistry and consumables; operate and troubleshoot CMP platforms; lead root-cause activities for yield issues; correlate inline metrics with electrical/yield outcomes; produce technical reports and IP disclosures; train field/service personnel on process transfer.
Seniority
Senior, hands-on IC