CMP Process Engineer
Core
Planarize wafer surfaces using chemical and mechanical forces to ensure high-precision chip layering.
Role type
Semiconductor process engineer (CMP)
Builds
Semiconductor wafers for integrated circuit manufacturing
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Required skills
Chemical/Mechanical/Electrical/Industrial Engineering/Physics/Chemistry/Material Science/Computer Science background, CMP process fundamentals (dielectric/metal), Statistical Process Control (SPC), Fault Detection and Classification (FDC), JMP/Spotfire, root-cause analysis (FMEA/8D), DOE, equipment familiarity (AMAT/Ebara)
Preferred skills
Metrology tools (Ellipsometry/SEM/AFM), defect reduction, fab integration knowledge
Technologies
AMAT, Ebara, JMP, Spotfire, Ellipsometry, SEM, AFM
Responsibilities
Control Removal Rate (RR) and thickness skew, optimize process conditions for uniformity, manage and optimize recipe parameters, manage wafer uniformity and defects, monitor consumable life cycles, evaluate slurry and pad performance
Seniority
Mid-Senior level (5+ years experience)