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Senior Director, Dry Etch Development Engineering

US, Oregon, Hillsboro💼 Full-time💰 $248,400–$350,690🗓 2026-08-28 → 2026-09-25

Core

Leads module development engineers to drive dry etch technology development, enablement, and feasibility studies for device specifications across wafer processing and module repair factories.

Role type

Senior Director, Dry Etch Development Engineering

Builds

Integrated process solutions for wafer processing, assembly/test, and module repair factories

Domain

Semiconductor manufacturing, Dry Etch

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Senior management in multinational manufacturing, Semiconductor process development leadership, Dry etch equipment platform expertise, Global factory ramp-up leadership, Fab start-up experience, Supplier partnership management

Preferred skills

Logic technology development, Packaging, Silicon process technologies, Foundry environment experience

Technologies

Dry etch equipment platforms

Responsibilities

Lead module development engineers to drive technology development and enablement; Ensure execution of module improvement responsibilities and oversee process/equipment performance; Drive cross-organizational alignment for process-pathway solutions; Partner with supplier executive management for innovative solutions; Coach teams to reverse engineer repair and improvement opportunities; Hire, manage, and coach engineers in advanced technology development

Seniority

Senior Director, Strategy & Mentorship

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