Test Development Engineer
Core
Lead the design, development, and enablement of advanced manufacturing test processes and hardware solutions for semiconductor packaging technologies.
Role type
Module Development Engineer (Semiconductor Test Technology)
Builds
Advanced test manufacturing processes, tooling, equipment, and system designs for standard and advanced packaging (EMIB-T, Foveros, FCBGAs).
Domain
Semiconductor manufacturing / Advanced packaging / Test technology
Deliverable
production ML models | product features | infrastructure
Required skills
Design of Experiments (DOE), statistical analysis, theoretical simulations, practical engineering methods, equipment modification, cross-functional collaboration, industrial trend analysis, pathfinding innovation.
Preferred skills
N/A
Technologies
N/A
Responsibilities
Lead design and development of advanced test manufacturing processes including material selection, tooling design, equipment, and system design; Develop and execute feasibility studies through theoretical simulations and/or practical engineering methods; Perform pathfinding activities to explore and innovate process and hardware solutions; Research, analyze, and implement modifications to operating equipment to improve efficiency; Collaborate with equipment and materials suppliers to develop enabling technologies; Monitor and interpret industrial trends in test manufacturing; Utilize DOE principles and statistical analysis to guide engineering decisions; Drive disciplined execution of R&D activities.
Seniority
Mid-level IC
