Senior Product Engineer

## About the role The candidate for this position will be expected and able to complete the following responsibilities and also play the role of a Technical Program Management : - Interface with Foundry, OSAT and System Integrators to drive execution readiness and capacity scaling - Ensure alignment on build plans, material readiness, and recovery strategies - Lead cross-functional resolution of execution risks across the supply chain - Drive alignment across design, test, packaging, manufacturing, and supply chain teams - Lead complex problems solving under ramp pressure (excursions, bottlenecks, supply constraints) - Influence program decisions with data-driven insights and clear trade-offs - ATE Test Program Execution and Debug at Wafer and Package Level, includes Test Program modifications. - Translate silicon specs (timing, voltage, power, redundancy, security) into robust test coverage and guard-banding - Own yield ramp from NPI to HVM: yield monitoring, DOE, excursion management, and continuous improvement - Lead structured failure analysis and RMA feedback loops to improve silicon quality and manufacturability - Drive test time optimization and cost efficiency - Establish production system frameworks (capacity, cycle time, output predictability, recovery models) - Identify and eliminate scale-induced failure modes (test escapes, yield cliffs, supply gaps) - Leverage data analytics / telemetry (e.g. Advantest RTDI, test platforms) for real-time decision making ## Requirements - Experience with Technical Program Management or have keen interest in Program Management role. - 10+ years in product / test / manufacturing engineering for advanced silicon (CPU, GPU, AI SoC) - Strong expertise in: - ATE test program development, characterization, and debug - Yield analysis, DOE, and failure analysis - High-volume manufacturing and OSAT operations - Proven track record delivering NPI → HVM ramp in complex silicon programs - Experience scaling hyperscale / datacenter silicon programs - Deep understanding of advanced packaging (2.5D/3D, chiplets) and system-level interactions - Familiarity with data/AI-driven manufacturing systems (e.g., predictive yield, telemetry analytics) - Strong cross-functional leadership and stakeholder management ## What we offer This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.