Senior Integration Lead - Advanced Packaging 3DHi and 2.5D
Core
Lead integrator for complex 3DHi and 2.5D technology development programs, translating customer requirements into integration architectures, qualification strategies, and executable roadmaps.
Role type
Senior IC advanced packaging integration lead
Builds
Chiplet-based 2.5D and 3DHi solutions including silicon interposers, TSVs, hybrid bonding, and package-level integration
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
3D heterogeneous integration, chiplet architecture, silicon interposers, TSV integration, hybrid bonding, die-to-wafer/wafer-to-wafer bonding, process flow definition, test vehicle development, DOE planning, failure analysis, yield improvement, cross-functional leadership
Preferred skills
Singapore semiconductor ecosystem experience, 2.5D/3D design enablement, thermal/mechanical modeling, high-volume manufacturing hand-off
Technologies
Silicon interposers, TSVs, micro-bumps, Cu-Cu hybrid bonding, redistribution layers, underfill, wafer thinning
Responsibilities
Define end-to-end process flows for 2.5D/3DHi solutions; own integration trade-off analysis across electrical, thermal, mechanical, and reliability; lead development of test structures and qualification vehicles; establish process control and metrology strategies; analyze yield and reliability data to drive corrective actions; lead cross-functional execution from concept to manufacturing transfer
Seniority
Senior, hands-on IC with program ownership
