DFM Engineer
Core
Primary engineering interface between hardware design, package manufacturing, and suppliers to lead DFM/DFR of optical transceiver manufacturing processes.
Role type
Senior DFM Engineer (Optical Transceivers)
Builds
Optical transceiver packages (pluggable, NPO, CPO) for AI supercomputing infrastructure
Domain
Photonics / Optical Interconnects / Semiconductor Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Transceiver assembly process development, Material/Chemistry/Mechanical/Electrical/Optical knowledge, SMT/Die Attach/Wire Bonding/Flip Chip/TCB Bonding/Underfill/FAU Active Alignment, Risk analysis, Data review and reporting
Preferred skills
Familiarity with Cadence, Solidworks, JMP, FMEA, Control Plan, SPC, 8D
Technologies
SMT, Die bonder, Active aligner, TCB bonding equipment, FR4, PIC chip, EIC chip, FAU, SMD
Responsibilities
Lead DFM/DFR for various transceiver designs, Perform capability assessment and risk analysis of processes/machines/materials, Engage with packaging production teams during early process development, Collect and summarize data for decision making
Seniority
Senior, hands-on IC