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DFM Engineer

Chon Buri💼 Full-time🗓 2026-08-18 → 2026-09-25

Core

Primary engineering interface between hardware design, package manufacturing, and suppliers to lead DFM/DFR of optical transceiver manufacturing processes.

Role type

Senior DFM Engineer (Optical Transceivers)

Builds

Optical transceiver packages (pluggable, NPO, CPO) for AI supercomputing infrastructure

Domain

Photonics / Optical Interconnects / Semiconductor Packaging

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Transceiver assembly process development, Material/Chemistry/Mechanical/Electrical/Optical knowledge, SMT/Die Attach/Wire Bonding/Flip Chip/TCB Bonding/Underfill/FAU Active Alignment, Risk analysis, Data review and reporting

Preferred skills

Familiarity with Cadence, Solidworks, JMP, FMEA, Control Plan, SPC, 8D

Technologies

SMT, Die bonder, Active aligner, TCB bonding equipment, FR4, PIC chip, EIC chip, FAU, SMD

Responsibilities

Lead DFM/DFR for various transceiver designs, Perform capability assessment and risk analysis of processes/machines/materials, Engage with packaging production teams during early process development, Collect and summarize data for decision making

Seniority

Senior, hands-on IC

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