SMTS Device Modeling & Characterization
Core
Develops compact SPICE models for FDSOI, FinFET, Bulk MOSFETs, MRAM, and RRAM for RF/MMW applications to support customer chip design.
Role type
Senior IC device modeling engineer (SPICE/compact models)
Builds
Process Design Kits (PDKs) and compact models for digital/analog/RF chips
Domain
Semiconductor manufacturing, RF/MMW, device physics
Deliverable
production ML models | product features
Required skills
MOSFET device physics, compact model extraction, test structure design, model-to-HW correlation analysis, cross-functional technical leadership
Preferred skills
FDSOI and FinFET expertise, BSIM families knowledge, MBP/ICCAP tool proficiency, high-frequency characterization experience
Technologies
SPICE, MBP, ICCAP, FDSOI, FinFET, Bulk MOSFET, MRAM, RRAM
Responsibilities
Design MOSFET characterization structures for compact model extraction; Develop Compact models for FDSOI, FinFET and Bulk technologies for RF/MMW applications; Deliver Model-to-HW correlation reports and K, CpK Analysis; Coaches and mentors team members; Leads cross-functional teams across sites
Seniority
Senior, hands-on IC with strategic project leadership
