SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC
Core
Lead end-to-end integration strategy and readiness for 2.5D/3D advanced packaging technology platforms including silicon/glass/mold interposers, silicon bridges, and deep trench capacitors.
Role type
Senior IC advanced packaging integration engineer
Builds
2.5D/3D heterogeneous integration solutions for chiplet-based systems
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
BEOL processes, advanced packaging integration, RDL/UBM metallization, wafer thinning/backside processing, wafer test/probe, OSAT collaboration, package development & assembly, design of experiment, statistical analysis, yield/reliability learning, technical leadership, cross-functional influence
Preferred skills
PhD level education, prior leadership experience, project management, innovation execution, ambiguity navigation
Technologies
2.5D interposer, 3D interposer, silicon bridge, deep trench capacitor, RDL, UBM, OSAT tools
Responsibilities
Lead integration strategy and readiness for 2.5D/3D platforms; Partner with cross-functional teams and tool/material vendors; Drive end-to-end process integration and prototyping; Own integration risk assessment and reliability strategy; Promote technical innovation via patents and methodologies; Mentor new hires
Seniority
Senior, hands-on IC with technical leadership
