Advanced Packaging Platform Lead — Yield & Data Analytics
Core
Own assembly and test yield for advanced packaging platforms from NPI through high-volume manufacturing, driving root cause analysis and partner engagement.
Role type
Senior IC yield engineering lead (advanced packaging)
Builds
Advanced packaging products (2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge)
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models
Required skills
Root cause analysis, Yield ramp management, OSAT/foundry partner management, SQL, Python, Data readiness definition, Pareto analysis, AI-assisted analytics
Preferred skills
2.5D/3D/3.5D heterogeneous integration, Fan-out, Silicon bridge, Hybrid bonding, STDF, Die-level traceability, B2B data feeds, Executive communication, Cross-functional task force leadership
Technologies
Snowflake, SQL, Python, STDF
Responsibilities
Own packaging yield for a portfolio of advanced packaging products from NPI through ramp to high-volume manufacturing; Lead technical engagement with OSAT and foundry partners to set yield targets and drive corrective actions; Drive root cause analysis on yield issues with ≤1-day time to first actionable insight; Build and maintain root cause Paretos for each product; Publish weekly yield reports and lead reviews; Define data-readiness requirements with partners; Mentor analysts and shape AI-assisted analytics tools
Seniority
Senior, hands-on IC
