Packaging Engineer
Core
Lead assembly technology development with OSAT and foundry partners to meet future requirements for advanced semiconductor packaging.
Role type
Senior IC packaging engineer (assembly technology)
Builds
Advanced assembly technology capabilities for large module on substrate assembly
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
OSAT management, die bond methods, underfill, lid attach, large module assembly, FMEA, SPC, control plans
Preferred skills
Leadership in managing OSATs and teams, chip on wafer/panel experience, chip on substrate experience
Technologies
FMEA, SPC, control plans
Responsibilities
Drive OSAT to develop advanced assembly technology capabilities; Collaborate with integration and design teams to integrate assembly and design needs; Establish ecosystem partners to identify assembly capability improvement roadmap
Seniority
Senior, hands-on IC