3D IC and SoC CAD ENGINEER
Core
Develop automated design flows and AI-driven solutions for 3D IC stack and advanced packaging design, optimizing Quality of Results (QoR) for complex heterogeneous systems.
Role type
Senior IC 3D IC and SoC CAD Engineer (AI/ML focus)
Builds
Automated 3D-IC and advanced packaging design flows (RTL to signoff) for AMD's next-gen processors
Domain
Semiconductor / EDA / 3D IC and Advanced Packaging
Deliverable
production ML models
Required skills
3D IC and advanced packaging design flows, EDA tools (ICC2, Innovus, Primetime), Python/TCL/Perl scripting, Machine Learning (ML) and LLM application to CAD, chip-level netlist debugging, system-level design verification (LEC, LVS, DRC), Linux/Unix environment, advanced-node tapeout experience
Preferred skills
Advanced packaging technologies (2.5D, 3D, 3.5D, interposers, silicon bridges), chip-level construction (PDN, bump planning), distributed/cloud compute environments
Technologies
ICC2, Innovus, Primetime, DEF, LEF, SPEF, Verilog, UPF, OAS, GDS, Python, TCL, Perl, Linux/Unix
Responsibilities
Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff, Lead hands-on debug and automation involving large chip level physical and logical netlists, Partner with EDA vendors on 3D-IC feature requirements and AI co-development, Develop and integrate end-to-end AI capabilities into CAD flows, Define strategy to ensure flows meet future design requirements and advanced technology nodes, Work closely with design teams to deliver tools meeting key QoR metrics (Timing, Area, Performance)
