Mechanical Engineering Lead - AI Rack Scale Systems
Core
Lead mechanical design, thermal architecture, and system integration for rack-scale AI compute platforms (ORV3/ORW) featuring fully liquid-cooled infrastructure.
Role type
Senior IC Mechanical Engineering Lead (AI Data Center Hardware)
Builds
AI compute trays, rack enclosures, and liquid-cooled data center systems for large-scale LLM training and inference
Domain
AI Infrastructure / Data Center Hardware / Liquid Cooling
Deliverable
production ML models | product features
Required skills
Mechanical design (tray/rack level), Liquid cooling system design, DFMA, Tolerance stack-up analysis, FEA, ODM/JDM management, Reliability testing, OCP standards compliance
Preferred skills
High-power AI accelerator design, OCP ORV3/ORW platform experience, Direct-to-chip liquid cooling integration, High-volume manufacturing in Asia
Technologies
3D modeling, 2D drawings, FEA tools, OCP Open Rack standards, QD fittings, CDU interfaces
Responsibilities
Own mechanical design from concept to production, Direct mechanical engineers on 3D models/2D drawings, Lead liquid cooling design and qualification, Champion DFM/DFA practices, Serve as lead mechanical point of contact for JDM/ODM, Mentor mechanical/thermal team
Seniority
Senior, hands-on IC with leadership responsibilities