2027 Masters ASIC Package Engineering Co-op/Intern
Hybrid · United StatesNo visa sponsorship
Core
Support Package design and Package Development Engineers in prioritizing and optimizing new projects for advanced packaging technology.
Role type
Masters level ASIC Package Engineering Co-op/Intern
Builds
Substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Substrate design, Interposer design, Bump design, Design verification, Yield analysis, Defect metric analysis, Packaging material evaluation, Perl scripting, Python scripting, SQL, PowerBI
Preferred skills
Transmission lines and electric circuits, Package/silicon/PCB design software, Semiconductor theory, Packaging process/technology
Technologies
Perl, Python, SQL, PowerBI
