2027 Masters ASIC Package Engineering Co-op/Intern
Core
Support Package design and Package Development Engineers in prioritizing and optimizing new projects for advanced packaging technology.
Role type
Masters level ASIC Package Engineering Co-op/Intern
Builds
Substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates
Domain
Semiconductor manufacturing and advanced packaging
Required skills
Package design, substrate design, interposer design, bump design, design verification, yield analysis, defect analysis, material benchmarking, Perl, Python, SQL, PowerBI
Preferred skills
Transmission lines and electric circuits, PCB design software, semiconductor theory, packaging process/technology
Technologies
Perl, Python, SQL, PowerBI
Responsibilities
Support package design and development engineers in project prioritization and optimization; Complete substrate, interposer, and bump designs; Execute design verification implementation projects; Analyze yield and defect metrics to improve design performance; Evaluate and benchmark packaging materials for cost efficiency and performance.
Seniority
Masters student, hands-on IC
