2027 Undergrad ASIC Package Engineering Co-op/Intern
HybridNo visa sponsorship
Core
Support ASIC Package Design and Development Engineers in optimizing projects, designing substrates/interposers/bumps, verifying designs, and analyzing yield metrics.
Role type
Undergraduate ASIC Package Engineering Co-op/Intern
Builds
Advanced packaging technology for AMD products, test vehicles, and probe card substrates
Domain
Semiconductor manufacturing and packaging
Required skills
Substrate design, Interposer design, Bump design, Design verification, Yield analysis, Defect metric analysis, Packaging material benchmarking, Perl scripting, Python scripting, SQL, PowerBI
Preferred skills
Transmission lines knowledge, Electric circuits knowledge, Package design software, PCB design software, Semiconductor theory knowledge, Packaging process knowledge
Technologies
Perl, Python, SQL, PowerBI
