2027 Undergrad ASIC Package Engineering Co-op/Intern
Core
Support Package design and Package Development Engineers in prioritizing and optimizing new projects for advanced packaging technology.
Role type
Undergraduate co-op/intern ASIC Package Engineer
Builds
Substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Substrate design, Interposer design, Bump design, Design verification, Yield analysis, Defect metric analysis, Packaging material evaluation, Benchmarking, Perl scripting, Python scripting, SQL, PowerBI
Preferred skills
Transmission lines and electric circuits, Package/silicon/PCB design software, Semiconductor theory, Packaging process/technology
Technologies
Perl, Python, SQL, PowerBI, Package design software, Silicon design software, PCB design software
Responsibilities
Support package design and development engineers in project prioritization and optimization, Complete substrate, interposer, and bump designs, Implement design verification to ensure performance and quality, Analyze yield and defect metrics to improve design performance, Evaluate and benchmark packaging materials for cost-efficiency and performance
