CPU Core Physical Design Thermal Modeling Lead
Core
Lead Physical Design Engineer ensuring CPU Cores and SoCs meet thermal requirements and silicon performance by developing thermal modeling methodologies and aligning power/thermal constraints across IPs.
Role type
Senior IC physical design lead (thermal/power)
Builds
CPU cores and System-on-Chip (SoC) designs
Domain
Semiconductor / High-performance computing
Required skills
Physical design methodology, EDA tools, power and thermal metrics, high-performance SoC/IP design, package modeling, scripting and flow automation
Preferred skills
Cross-functional alignment, pre-silicon design collaboration, architecture assumption alignment
Technologies
EDA tools, package models
Responsibilities
Drive development and alignment of thermal modeling methodology; Drive new design and analysis methodologies to improve product thermal profile; Translate product usage models into IP performance, power, and thermal constraints; Drive thermal product requirements cross-functionally and manage critical deliverables at project milestones
Seniority
Senior, hands-on IC
