AI Automation Design Packaging Lead
Core
Lead the development and deployment of AI-driven workflows for advanced heterogeneous integration packaging design, specifically substrates, organic interposers, and bridge interconnects.
Role type
Senior IC Lead, AI Automation for Advanced Packaging
Builds
AI/ML workflows for auto-routing, component placement, and signal integrity optimization in 2.5D/3D packaging
Domain
Semiconductor manufacturing / Advanced Packaging / AI Engineering
Deliverable
production ML models
Required skills
AI/ML framework development, EDA tool automation, Python/Tcl/SKILL/C++, advanced packaging architecture knowledge, cross-functional technical leadership
Preferred skills
Experience with Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler; familiarity with DRC/LVS flows; experience with PyTorch or TensorFlow
Technologies
Python, Tcl, SKILL, C++, PyTorch, TensorFlow, Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler
Responsibilities
Drive development of AI workflows for substrate and interposer design; Deploy AI/ML to optimize auto-routing and placement; Collaborate with EDA vendors on feature roadmaps; Lead transition to algorithmic design models; Coordinate closed-loop optimization with analysis teams; Mentor junior engineers in coding and packaging concepts
Seniority
Senior, hands-on IC with leadership responsibilities
