Process Integrator Advanced Packaging & Co-Packaged Optics R&D
Core
Lead development and integration of advanced semiconductor packaging modules and co-packaged optics (CPO) in an R&D environment, connecting unit processes, materials, and device requirements into robust integrated flows.
Role type
Senior IC process integrator (advanced packaging & CPO)
Builds
Advanced packaging modules, photonic integrated circuits, optical engines, and heterogeneous integration solutions for semiconductor and display applications.
Domain
Semiconductor manufacturing, photonics, advanced packaging, and materials science.
Required skills
End-to-end process integration, CPO and silicon photonics expertise, die-to-wafer/wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, DOE design and execution, cross-functional program leadership, risk assessment and mitigation, technology roadmap development.
Preferred skills
Experience with optical/electrical heterogeneous integration, laser/modulator/detector integration, thermal-mechanical stress management, defectivity and yield optimization.
Technologies
Photonic integrated circuits, optical engines, interposers, substrates, fiber interfaces, lithography, deposition, etch, CMP, plating, metrology, optical test, electrical test, failure analysis, modeling.
Responsibilities
Own end-to-end process integration from concept through technology transfer; develop integrated process flows for photonic and electronic ICs; translate optical, electrical, thermal, and mechanical requirements into process specifications; lead cross-functional execution across bonding, lithography, and test teams; design and execute structured experiments to optimize performance and reliability; identify and resolve CPO integration risks; create technology roadmaps and executive reports.
Seniority
Senior, hands-on IC with program leadership