Principal Photonics Integration Engineer
Core
Lead the development and integration of silicon photonics and heterogeneous integration technologies to enable high-performance optical connectivity solutions for AI, HPC, and data infrastructure.
Role type
Principal IC photonics integration engineer
Builds
Silicon photonics devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures
Domain
Semiconductor manufacturing / Photonics / Advanced Packaging
Required skills
Silicon photonics process integration, Semiconductor process integration, Wafer fabrication, Process characterization, DOE methodology, Statistical analysis, Process flow architecture, Device integration, Design rule development, Tape out execution
Preferred skills
III-V semiconductor technologies, Heterogeneous integration platforms, Advanced packaging (hybrid bonding, wafer bonding, optical interposers, co-packaged optics), Optical interconnect technologies, AI/machine learning for engineering
Technologies
Silicon photonics, III-V semiconductors, Hybrid bonding, Wafer bonding, Optical interposers, Co-packaged optics
Responsibilities
Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness, Lead integration and process development for photonic devices and optical interconnects, Drive process characterization, DOE execution, yield improvement, and defect reduction, Partner with design, device, packaging, and manufacturing teams to support design rule development and technology transfers, Lead technical programs and AI-enabled engineering initiatives
Seniority
Principal, hands-on IC with program leadership