Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging)
Core
Lead the development and integration of advanced packaging technologies, specifically Hybrid Bonding solutions for Logic, Memory, and 3D heterogeneous integration applications.
Role type
Senior IC process development engineer (advanced packaging)
Builds
Hybrid Bonding processes and advanced packaging solutions for HBM, Logic, and 3D heterogeneous integration
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Hybrid Bonding, CMP, Plasma Processing, Wet Cleaning, TSV Integration, Process Integration, DOE, Statistical Process Analysis, Reliability, Failure Analysis, Advanced Metrology
Preferred skills
Hybrid Bonding mechanisms, Package integration flows, JMP/Minitab, Reliability, Failure analysis, Advanced metrology
Technologies
Optical inspection, IR imaging, SEM, AFM, XPS, Contact angle measurement, Electrical test
Responsibilities
Develop and optimize end-to-end Hybrid Bonding processes (wafer/die preparation, cleaning, plasma activation, dielectric-to-dielectric bonding, Cu-Cu direct bonding, annealing); Design and execute process characterization and DOE studies to establish process windows; Investigate and resolve process integration challenges (CMP topography, contamination, warpage, defectivity); Collaborate with equipment, materials, metrology, and integration teams; Define and implement characterization methodologies; Support development of advanced packaging technologies (HBM, Logic, TSV, RDL); Engage customers and partners on joint technology projects; Generate technical reports, patents, and roadmaps.