MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
Core
Develop and optimize unit processes for advanced packaging (bond/debond, pre-bond, die re-constitution, annealing, TSV) on multi-stack bond wafers and die-to-wafer processes.
Role type
Principal Process Module Engineer (Advanced Packaging)
Builds
300mm advanced packaging solutions for high-performance, power-efficient semiconductors
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE techniques, statistical process control, root cause analysis, equipment qualification, process troubleshooting, lean manufacturing, Six Sigma, cross-module project coordination, technical coaching
Preferred skills
Experience with Si interposer, D2W, W2W process tools, CIP program initiation
Technologies
Plasma, UV, cleaning, annealing, TSV, multi-stack bond wafers, frame form carriers
Responsibilities
Design and execute experiments to develop advanced packaging etch processes; startup and qualify new processes and equipment; improve process robustness using statistical tools; resolve complex technical and yield issues; coach other engineers on process knowledge; facilitate CIP programs to optimize process window and yield.
Seniority
Principal, hands-on IC with strategy & mentorship
