Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)
Based in Singapore
Core
Develop and integrate advanced packaging building blocks including redistribution layers, damascene copper structures, wafer-level interconnects, and hybrid bonding processes.
Role type
Intern, Process Integration Engineer (Advanced Packaging)
Builds
Test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding applications
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Process flow development, experimental design, data analysis, defect characterization, statistical data analysis, engineering problem-solving
Responsibilities
Develop and characterize test vehicles for hybrid bonding applications, correlate process parameters to electrical and physical performance metrics, support R&D projects for next-generation semiconductor packaging