Principal Engineer Advanced Package Technology Development
Core
Drive innovation in advanced packaging technology roadmaps and investment priorities for memory and storage solutions, balancing performance, scalability, and cost.
Role type
Principal Engineer (Advanced Packaging Technology Development)
Builds
Production-ready memory and storage technologies for the AI era
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging strategy, High Bandwidth Memory, 2.5D integration, 3D integration, Hybrid bonding, Wafer Level Packaging, 3D stacking, DRAM manufacturing, OSAT operations
Preferred skills
DRAM wafer structure knowledge, East Asian languages, patent inventions
Technologies
High Bandwidth Memory, 2.5D integration, 3D integration, Hybrid bonding
Responsibilities
Shape technology roadmaps and investment priorities, consult on senior management technical decisions, analyze competitive trends, define requirements with technical data, drive technical innovation through patents and papers
Seniority
Principal, strategic leadership & hands-on expertise