Process Engineering Intern
Core
Develop and optimize electrodeposition processes for wafer fab equipment (WFE) in advanced packaging, including through Silicon via and through glass via.
Role type
Process Engineering Intern
Builds
WFE electrodeposition processes and reactor performance enhancements
Domain
Semiconductor manufacturing / Advanced packaging / Electrochemistry
Required skills
Electrodeposition process development, Wet laboratory operations, Equipment troubleshooting, Modeling and simulation, Data compilation and scientific research
Preferred skills
Electrochemistry (copper, tin, nickel), Grain growth mechanisms, Microstructure evolution, Bath chemistry and additives, Defect characterization
Technologies
Lam SABRE 3D system, Metrology tools, Application lab deposition development tool
Responsibilities
Set up and run bench scale experiments, Operate application lab deposition development tool, Conduct chemistry and material analysis, Use metrology tools to measure wafer deposition performance, Support product development and technology support, Conduct scientific journal research
Seniority
Intern