Capital Equipment Hardware engineer - Advanced Packaging
Core
Support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform for advanced packaging development programs.
Role type
Senior IC capital equipment hardware engineer (advanced packaging)
Builds
Kinex™ Hybrid Bonding platform for die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Semiconductor equipment support, system integration, startup execution, facilities coordination, vendor engagement, mechanical/electrical/automation troubleshooting, root cause analysis, preventative maintenance, uptime improvement
Preferred skills
Advanced packaging equipment, hybrid bonding, wafer bonding, die attach, packaging, assembly systems, wet clean processes, automated material handling, vacuum systems, plasma processing, metrology systems, site prep documentation, equipment specifications
Technologies
Kinex™ platform, BESI equipment, 300 mm tools
Responsibilities
Support tool dock through release to engineering users, coordinate Tier 0/1/2 startup activities, drive closure of installation punch-list items, support factory and site acceptance activities, perform troubleshooting of mechanical/electrical/automation/process issues, develop preventative maintenance procedures, analyze equipment performance and reliability trends, drive root cause investigations, act as primary technical interface with product engineering teams, support hybrid bonding process development activities, enable wafer-to-wafer and die-to-wafer bonding development
Seniority
Mid-Senior, hands-on IC