Process Engineer V
Core
Designing and optimizing manufacturing processes for co-packaged optics (CPO) modules, integrating photonic and electronic die, optical engines, and fiber interfaces.
Role type
Senior IC process engineer (CPO/heterogeneous integration)
Builds
CPO modules and heterogeneous integration flows for semiconductor and display technologies
Domain
Semiconductor manufacturing / Photonics / Advanced packaging
Required skills
Heterogeneous integration (hybrid/fusion bonding, D2W/W2W, TSVs, interposers), Optical coupling and alignment, Thermal management, DOE and statistical analysis, Root-cause analysis, Vendor and supplier management
Preferred skills
Patents or publications in CPO/photonics, Optical test and characterization, Engagement with CPO ecosystem partners
Technologies
Co-packaged optics (CPO), Silicon photonics, Photonic integrated circuits, Optical engines, Fiber interfaces
Responsibilities
Extend heterogeneous integration flows to CPO, Address CPO-specific integration requirements (optical loss, thermal management), Create technology roadmaps and risk assessments, Lead practical application of scientific theory to complex CPO processes, Interact with key customers to resolve High Value Problems (HVP), Participate in strategic planning connecting R&D with business plans
Seniority
Senior, hands-on IC with thought leadership