Director, Advanced Packaging Disruptive Technology (Based in Singapore)
Core
Define and drive pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
Role type
Director, Advanced Packaging Technology Strategy & Innovation
Builds
Exploratory, pre-product technologies (D2W, RDL, CoWoS, TSV, etc.) and scalable, differentiated solutions for semiconductor manufacturing.
Domain
Semiconductor manufacturing / Advanced Packaging / Materials Engineering
Required skills
Advanced packaging technology expertise, technology pathfinding, innovation strategy, cross-functional team leadership, ecosystem partnership management, strategic roadmap planning, make/buy/partner decision making, customer insight translation, executive communication
Preferred skills
PhD/MS in Materials Science/EE/Mechanical Engineering/Physics, heterogeneous integration experience, chiplet ecosystem knowledge, industry ecosystem network, first-of-a-kind technology delivery track record
Technologies
D2W, RDL, CoWoS, TSV, heterogeneous integration, chiplet ecosystems, advanced substrate innovations
Responsibilities
Define long-range pathfinding roadmaps for advanced packaging, drive concept incubation for disruptive packaging approaches, evaluate emerging technology options, build and lead high-impact innovation teams, translate customer roadmaps into technology strategies, build collaborative innovation ecosystems across suppliers and foundries, establish governance models for early-stage technology programs
Seniority
Director, strategic leadership & team building
