Key Account Technologist (Advanced Packaging)
Core
Strategic technology leader partnering with semiconductor customers to define future advanced packaging solutions and influence product innovation.
Role type
Senior IC Key Account Technologist (Advanced Packaging)
Builds
Electron microscopy portfolio and strategic customer partnerships
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
product features
Required skills
semiconductor technology roadmaps, heterogeneous integration, hybrid bonding, high bandwidth memory, chiplets, die-to-wafer integration, wafer-to-wafer integration, photonics, customer roadmap analysis, strategic account planning, cross-functional collaboration, technical market intelligence
Preferred skills
semiconductor equipment manufacturing, device manufacturing, foundries, failure analysis, process integration, yield engineering, metrology, applications engineering, technical marketing, product strategy
Technologies
Electron microscopy, Heterogeneous Integration, Hybrid Bonding, HBM, Chiplets, Die-to-Wafer, Wafer-to-Wafer, Photonics
Responsibilities
Develop understanding of advanced semiconductor packaging trends and customer roadmaps; Build trusted relationships with strategic semiconductor customers; Translate customer insights into actionable recommendations for product and business leadership; Identify technology gaps and innovation priorities; Collaborate across product management, field applications, sales, and executive leadership; Contribute to innovation initiatives including new workflow concepts and portfolio planning
Seniority
Senior, hands-on IC