Director, Process Support Engineer (Advanced Packaging)
Core
Lead technical resolution of complex advanced packaging process challenges for semiconductor customers through systematic troubleshooting, DOE, and cross-functional coordination.
Role type
Director, Process Support Engineer (Advanced Packaging)
Builds
Advanced packaging process flows, technology transfer, and customer enablement for next-generation semiconductor solutions.
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Root cause analysis, Design of Experiments (DOE), statistical process control, failure analysis, yield improvement, process integration, technology transfer, strategic customer engagement, cross-functional leadership
Preferred skills
PhD/Master's in Materials/Chemical/Electrical Engineering, 15+ years semiconductor experience, expertise in Fan-Out/CoWoS/2.5D/3D integration/RDL/TSV/hybrid bonding, experience with foundries/OSATs/IDMs
Technologies
Fan-Out, CoWoS, 2.5D/3D integration, RDL, TSV, hybrid bonding, electroplating, CMP, wafer-level processing, heterogeneous integration
Responsibilities
Lead resolution of complex customer process challenges using DOE and root cause analysis; Establish cross-functional issue management mechanisms; Provide technical leadership for customer demonstrations and technology evaluations; Partner with customers to optimize advanced packaging process flows; Act as subject matter expert for wafer-level packaging, fan-out, RDL, hybrid bonding, bumping, TSV, and heterogeneous integration; Collaborate with product development to influence roadmaps and drive enhancements; Lead technology transfer and production ramp support; Build strategic partnerships with manufacturers and research institutes; Represent company at executive-level customer engagements; Capture and communicate global customer insights and best practices.
Seniority
Director, strategic leadership & hands-on technical execution