Advanced Packaging Integration Engineer
Core
Lead process integration for high-performance interconnects and micro-LED panels to develop advanced packaging solutions for next-generation smart glasses and high-performance optical interconnects.
Role type
Senior IC advanced packaging integration engineer
Builds
Advanced packaging solutions for smart glasses and optical interconnects
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Advanced packaging technologies (wafer-to-wafer/die-to-wafer hybrid bonding, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, OSAT processes), Process integration, Experimental design and data analysis (DOE, SPC), Root-cause analysis, Cross-functional collaboration, Project management
Preferred skills
Micro-LED or CPO experience, Coding capability, MES system experience, Executive presentation skills
Technologies
JMP, MES systems
Responsibilities
Define, develop, execute, and optimize advanced packaging process integration flows; Own, manage, and drive complex technical projects; Design experiments, collect and analyze data, and implement corrective actions; Collaborate with foundries, OSATs, and internal teams to define and implement improved integration strategies; Stay abreast of field advancements and apply knowledge to drive innovations
Seniority
Senior, hands-on IC