数字设计负责人（存算与AI） - 芯片研发
Core
Lead the design and management of high-efficiency AI chips based on in-memory computing architecture to break the 'memory wall' bottleneck and provide a high-efficiency computing base for AI business.
Role type
Senior IC digital chip design lead (in-memory computing & AI)
Builds
High-efficiency AI chips based on in-memory computing architecture
Domain
Semiconductor / AI / In-memory computing
Deliverable
production ML models
Required skills
Digital chip design, RTL implementation, SoC integration, micro-architecture design, team management, project management, IP integration, GDSII flow, tape-out experience
Preferred skills
Mass production chip project experience, complex chip bring-up experience (AI/Compute, CPU/GPU, mobile, automotive, IoT)
Technologies
RTL, GDSII, SoC, IP
Responsibilities
Manage daily operations of the chip design team including recruitment, training, performance evaluation, and talent development; Lead the full lifecycle of chip projects from requirement analysis to architecture design, RTL implementation, and tape-out; Participate in chip product definition and technical roadmap planning, lead micro-architecture design and key technical decisions, and deliver key IP and SoC integration; Establish and improve chip design specifications, code review mechanisms, and quality control processes.
