芯片泛工艺专家-芯片研发
Core
Lead process technology evaluation, SPICE device modeling, and PIE integration for AI SoC chips to ensure manufacturability, electrical stability, and yield.
Role type
Senior IC process technology expert (AI SoC)
Builds
AI SoC chips with optimized process nodes and packaging solutions
Domain
Semiconductor manufacturing (Foundry) and Design
Required skills
SPICE device modeling (BSIM/PSP), PIE process integration, PDK development (DRC/LVS/DFM), DOE design, failure analysis (FIB/EMMI), Python/Tcl/Skill scripting, advanced packaging (3D IC/Chiplet/CoWoS)
Preferred skills
FinFET process development, AI SoC project leadership, mixed bonding/TSV experience
Technologies
SPICE, BSIM, PSP, Python, Tcl, Skill, DRC, LVS, DFM, WAT, CP, FT, FIB, EMMI, CoWoS, Fan-out, TSV
Responsibilities
Select and optimize process technology for AI SoC chips; calibrate and validate SPICE models across PVT corners; integrate front-end and back-end processes for NPI and mass production; collaborate with design teams to optimize chip performance and reliability; track and implement advanced technologies like 3D IC and Chiplet; manage supply chain process improvements and technical documentation.
Seniority
Senior, hands-on IC
