PCB Layout Expert – Automotive HPC Embedded Platforms
Core
Lead PCB layout for automotive high-performance computing (HPC) and chiplet platforms, delivering manufacturable designs with design teams and external suppliers.
Role type
Senior IC PCB Layout Expert (Automotive HPC/Chiplet)
Builds
Multilayer/HDI PCBs for automotive HPC and chiplet platforms
Domain
Automotive electronics, High-speed digital design, Chiplet technology
Required skills
Multilayer/HDI stack-up design, Fine-pitch BGA escape and routing, DDR/LPDDR/PCIe/Ethernet/SerDes routing, SI/PI constraint management, ECAD library management, DFM/DFA/DFT analysis, AI-assisted layout automation, Team mentoring
Preferred skills
Automotive industry experience, Scripting for ECAD automation, Customer technical presentation skills
Technologies
Cadence Allegro, Altium Designer, Gerber, ODB++, Drill files
Responsibilities
Own multilayer/HDI placement, fine-pitch BGA escape, and routing from approved schematics and mechanical constraints through release; Route DDR/LPDDR, PCIe, Ethernet, and SerDes to SI/PI constraints; Coordinate design, SI/PI, mechanical, manufacturing teams, and external PCB suppliers on stack-ups, materials, vias, cost, reliability, and manufacturability; Manage footprints, pad stacks, and ECAD libraries; Lead layout/DRC and DFM/DFA/DFT reviews, resolve supplier issues, and release Gerber/ODB++, drill, stack-up, drawing, placement, and BOM data; Mentor layout engineers; Maintain layout guidelines and checklists, and guide application notes and customer presentations explaining trade-offs and risks; Improve development handovers, reviews, change control, and release workflows using reusable practices, lessons learned, and supplier feedback; Apply AI-assisted tools and scripting to layout checks, library verification, and documentation; Validate outputs, protect design data, and measure cycle-time, quality, and rework improvements.
