半導体組立工程 技術開発エンジニア
Core
Develop assembly and packaging technologies for advanced semiconductor packages (Flip Chip, SiP, VPS, FCCSP, FCBGA) serving AI, HPC, automotive, and IoT markets.
Role type
Senior IC semiconductor assembly and packaging technology engineer
Builds
High-density, high-reliability, and high-thermal-conductivity semiconductor packages for next-gen AI/HPC and automotive chips
Domain
Semiconductor manufacturing / Advanced packaging / Electronics
Required skills
Semiconductor back-end assembly/packaging development, SMT/SPI/AOI/Flip Chip bonding/Flux cleaning process development, Process improvement, Quality management, Equipment selection and implementation, Technical degree (Mechanical/Materials/Electronics/Chemical)
Preferred skills
Failure analysis using FTA/5Why, Material selection and optimization, CAD design for fixtures/tools, Knowledge of IATF/JEDEC standards, Product management experience
Technologies
SMT, SPI, AOI, Flip Chip bonding, Flux cleaning, VPS, FCCSP, FCBGA, SiP
Responsibilities
Select and introduce assembly equipment for advanced packages, Develop and improve materials and processes for SMT/SPI/AOI/bonding/cleaning, Support production line launch and volume transition, Improve process quality and yield
Seniority
Senior, hands-on IC
