Senior PCB Layout Engineer – Automotive HPC Embedded Platforms
Core
Own PCB layout implementation for automotive HPC and chiplet-based platforms, translating schematics and constraints into manufacturable multilayer and HDI board designs.
Role type
Senior IC PCB Layout Engineer
Builds
Multilayer and HDI PCBs for automotive HPC and chiplet-based systems
Domain
Automotive electronics / High-speed digital design
Required skills
Multilayer stack-up design, HDI and fine-pitch BGA escape routing, constraint-driven routing (DDR/LPDDR, PCIe, Ethernet, SerDes), impedance and length matching, ECAD tool proficiency (Cadence Allegro, Altium Designer), DFM/DFA/DFT analysis, fabrication and assembly process knowledge
Preferred skills
Automotive PCB experience, knowledge of IPC standards
Technologies
Cadence Allegro, Altium Designer
Responsibilities
Component placement and detailed routing for high-density boards, define PCB stack-ups and via structures, implement power/ground planes and decoupling, create footprints and library data, prepare fabrication release packages (Gerber, drill files), conduct DRC/DFM checks and resolve supplier queries
Seniority
Senior, hands-on IC
