PCB Layout Expert – Automotive HPC Embedded Platforms
Core
Lead PCB layout for automotive high-performance computing (HPC) and chiplet platforms, delivering manufacturable designs with design teams and external suppliers.
Role type
Senior IC PCB Layout Engineer (Automotive HPC)
Builds
Multilayer/HDI PCBs for automotive HPC and chiplet platforms
Domain
Automotive electronics / High-speed digital design
Required skills
Multilayer/HDI stack-up design, Fine-pitch BGA escape, High-speed signaling (DDR/LPDDR, PCIe, Ethernet, SerDes), SI/PI constraint implementation, ECAD tool proficiency (Cadence Allegro, Altium), DFM/DFA/DFT analysis, Library management, AI-assisted automation scripting, Team mentoring
Preferred skills
Automotive industry experience, Thermal/EMC requirement management, Process improvement methodologies
Technologies
Cadence Allegro, Altium Designer, Gerber, ODB++, ECAD automation tools
Responsibilities
Own multilayer/HDI placement and routing from schematics to release; Route high-speed interfaces meeting SI/PI constraints; Coordinate with mechanical, manufacturing, and supplier teams on stack-ups and materials; Manage footprints, pad stacks, and ECAD libraries; Lead DRC/DFM reviews and release data; Mentor layout engineers and maintain guidelines; Apply AI tools to improve layout checks and efficiency.
Seniority
Senior, hands-on IC
