Senior Staff NPI Packaging Engineer
Core
Lead Wafer-Level Chip-Scale Package (WLCSP) new product introduction from development through mass production, serving as the final technical authority for package decisions impacting quality, yield, and reliability.
Role type
Senior Staff IC packaging engineer (WLCSP)
Builds
WLCSP packages and processes for automotive, industrial, infrastructure, and IoT applications
Domain
Semiconductor packaging and board-level reliability
Required skills
WLCSP package design, assembly flow definition, board-level reliability testing, failure analysis, root cause analysis, customer technical interface, cross-functional team coordination, process optimization, yield improvement, technical mentorship
Preferred skills
NPI program leadership, customer-facing technical roles, materials science knowledge
Technologies
WLCSP, PCB interactions, BLR test strategies
Responsibilities
Define and control assembly flow and critical process parameters, lead failure mechanism identification and corrective actions, host customer technical reviews and issue resolution meetings, coordinate global cross-functional teams, drive process optimization and reliability enhancement initiatives, mentor engineers
Seniority
Senior Staff, hands-on IC with strategic oversight