Staff IC Package Design Engineer
Core
Design IC semiconductor packages (WLCSP, BGA, FCCSP, SiP, QFN/DFN, leadframe-based) to meet manufacturing and reliability requirements.
Role type
Staff IC Package Design Engineer
Builds
Semiconductor packages for automotive, industrial, infrastructure, and IoT applications
Domain
Semiconductor manufacturing / IC packaging
Required skills
IC package design, WLCSP/BGA/FCCSP/SiP/QFN/DFN/leadframe technologies, Cadence APD/SiP, AutoCAD, manufacturability analysis, cross-functional collaboration, OSAT coordination
Preferred skills
Cadence Sigrity, Ansys tools, electrical modeling, simulation, SI/PI analysis, package optimization
Technologies
Cadence APD/SiP, AutoCAD, Cadence Sigrity, Ansys
Responsibilities
Create package layouts in compliance with design rules, drive package design from concept to production, optimize designs for electrical/mechanical/thermal/manufacturability requirements, resolve design challenges, collaborate with cross-functional teams and OSATs
Seniority
Staff, hands-on IC
