Sr Manager, Packaging Assembly Operation
Core
Lead high-volume semiconductor assembly operations for advanced packaging technologies, converting package technologies and NPI programs into scalable manufacturing execution to achieve production output and revenue targets.
Role type
Senior Manager, Semiconductor Assembly Operations
Builds
High-volume production of AI/data center power packaging (Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages) and wide-bandgap (SiC, GaN) devices.
Domain
Semiconductor Manufacturing / Advanced Packaging
Required skills
Semiconductor assembly operations leadership, NPI-to-HVM ramp execution, capacity planning, yield analysis, process change management, OSAT partner management, cross-functional collaboration, data-driven execution, root-cause analysis, team leadership
Preferred skills
Power packaging expertise (Smart Power Stages, Vertical Power Stages, Power Modules), Wide-bandgap technologies (SiC, GaN), DBC/AMB substrates, advanced interconnect technologies
Technologies
Wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, SPC, DOE
Responsibilities
Lead day-to-day assembly operations across global product lines and manufacturing partners; Drive production output, yield, and cycle time performance; Manage assembly capacity, throughput, and operational cost; Execute process change management and qualification plans; Partner with OSAT partners on capacity, material readiness, and quality; Lead NPI ramp readiness and high-volume manufacturing execution; Coach and develop a global assembly engineering team
Seniority
Senior, hands-on IC